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Words related to solder

an alloy (usually of lead and tin) used when melted to join two metal surfaces

join or fuse with solder

References in periodicals archive ?
Some of these "magic" ingredients are corrosive, which is why they are so effective, but this also means they need to be used in a manner that will prevent the tip tinner corrosive materials from remaining on the tip (FIGURE 9) or creating cross-contamination of the product being soldered.
A process by which both surface mount and thru-hole mounted components could be soldered in tandem was desired.
Generally, x-ray images of lead-free soldered joints are similar to SnPb, although grayscales may be slightly different for SAC solder because of the absence of lead.
Expensive robotics position the board and fixture over the fountain/wave for a preset dwell time, after fluxing and preheating, and the PCB is soldered all at once.
Based on the results of wetting angle measurements, the test pieces for testing shear strength of soldered joints were prepared.
Single-sided boards often can be soldered at high speed because they often have a low thermal demand and no plated-through barrel, and thus do not require topside fillets.
But luckily, if you take a methodical approach and a little extra care in cleaning and fluxing the joints, leaks in newly soldered copper pipes are rare.
Most cases of selective soldering are instituted to accommodate a small number of plated through-hole components usually manually soldered in an otherwise predominantly surface mounted assembly.
An example of microstructure in soldered joint consisted of silicon with Cr/Ni/Ag layers--In48Sn solder--Cu is shown in Fig.
After the BGA is removed from the oven and cooled, the polyimide portion of the preform is peeled from the device, leaving the solder balls soldered in place on the BGA.
You have to drain water lines and dry the tubing in the area being soldered.
A typical wave soldering machine operates at 245[degrees] to 260[degrees]C, whereas in selective soldering, the solder temperature is closer to 300[degrees]C for a variety of reasons that include the smaller area and heat-dissipative characteristics of the board, the type of component soldered, the need for through-hole filling, and others.