The new floor space's clean room has been completed and installation of some of the new bumping
equipment started in June.
Flip-Chip is being reshaped by a new kind of demand that is hungry for Cu pillars and micro-bumps, which are on their way to becoming the new mainstream bumping
metallurgy for die interconnection.
Haluk Balkan, Director of Engineering of FCI, said, "We are excited about our demonstration of 95 micron bumping
capability utilizing our solder paste technology.
IC Interconnect, located in Colorado Springs, Colorado, was founded in 1998 as part of The Eagle Electronics group to provide wafer bumping
services to the semiconductor industry.
Strategic Analysis of SMT Opportunities in Wafer Bumping
and Back-end Packaging
AMD's decision to license our Unitive lead free bumping
technology is an indication of Amkor's technological leadership in advanced packaging applications," said Oleg Khaykin, EVP and COO of Amkor.
The inherent cost advantages, flexibility, and ease of use make SUSS production lithography systems extremely attractive solutions for different wafer level packaging technologies, including solder bumping
, gold bumping
, redistribution layers (for wafer level packages and chip stacking) or re-passivation.
If the compensation offered won't cover the cost of damages you suffer as the result of bumping
, turn it down.
We intend for this facility to support our most advanced 300mm bumping
C4NP stands for Controlled Collapse Chip Connection - New Process and is the next generation of wafer bumping
technology developed by IBM.
BOC has partnered with Shinko Seiki, a leading supplier of plasma and vacuum soldering systems in Japan, to assist chip manufacturers with void-free and flux-free advanced solder bumping
Thick resist processing is an enabling technology for volume production in wafer level packaging and solder bumping
, which represent the two main markets for both companies.
Our customer is the clear leader in wafer bumping
technology, having licensed its industry-standard and advanced bumping
processes to the semiconductor industry's packaging heavyweights throughout the world.
MUNICH, Germany -- SUSS MicroTec (FWB:SMH)(GER:SMH), the leading manufacturer of lithography equipment for the wafer level packaging and solder bumping
market announced it has recently received orders for lithography systems and coat/bake/develop tracks from Siliconware Precision Industries (SPIL), one of the world's largest packaging foundries located in Taiwan.
NASDAQ:AMKR) today announced that it is establishing wafer bumping
operations in Singapore using the same processes currently employed by Amkor's Unitive subsidiary in Taiwan.