To succeed, the assembler must have a bonder
equipped with epoxy transfer tool technology, which was commonly used in the semiconductor industry 20 to 25 years ago.
Trace Optical also introduced Optilock, an off-line, dual-lane bonder
for any DVD format.
SUSS MicroTec Wafer Bonders
Continue to Capture Major Market Share in Advanced MEMS Manufacturing
For example, the new facility supports more high-accuracy wire bond and die attach demonstrations on automated bonders
, as well as contract manufacturing for complex hybrid applications through Palomar Technologies Assembly ServicesTM.
Palomar Technologies (formerly part of Hughes Aircraft Company) is one of the world's principal suppliers of automated high-precision wire bonders
and component placement systems along with process development and contract assembly services to increase yield and lower costs for manufacturers.
The 3800 Die Bonder
demonstration will reveal a fully automated component attach program highlighting the flexibility and high precision of the m placement accuracy die attach system.
com), World Chip Bonder
Markets, finds that the market earned revenues of $908.
The ultra flexible 3800 Die Bonder
is designed for fully automatic, precision microelectronics assembly.
The new ConnX(PS) wire bonder
replaces the Maxum Elite wire bonder
In addition to the expanded Palomar Asia Spare Parts Depot, Chan has also led the development of a Singapore-based demonstration laboratory in order to support increasing demand for in-person 8000 Wire Bonder
and 3800 Die Bonder
demonstrations with APAC customers.
Palomar uses its Model 8000 ball bonder
for certain low-profile interconnects, fine pitch, running-stitch interconnects, and die-to-die bonding where a wedge bonder
may have traditionally been used.
May 2, 2012 /PRNewswire-iReach/ -- Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced it will exhibit at SMT Nuremberg 2012, May 8-10, with live wire bonder
This truly makes the ball bonder
a viable and flexible alternative to a wedge bonder
A Palomar 3800 Die Bonder
and manual Hybond equipment will be on-site for demonstrations.
SUSS MicroTec developed three tools, one that uses stepper technology and two for pattern generation, to apply different embossing techniques: the FC 150 Device Bonder
, MA6 Mask Aligner and SB6 Substrate Bonder