The new Construction Chisel is an all-purpose bevel edge
chisel that also features an upgraded hardened and tempered blade to make jobs like carving out a recess for a hinge or strike plate easy and accurate.
The system has the capability of simultaneous defect removal from the front, back and bevel edge
of the wafer, thus offering a significant cost of ownership advantage.
This combination of system and cleaning chemistry removes contaminants from the front, back and bevel edge
of the wafer.
Mach2MP, like its predecessor, is available for a variety of applications and includes advanced technology: Goldfinger(TM) Megasonics and JetStream(TM) spray for small (less than 90 nm) and large particle removal; Goldfinger Backside Megasonics for backside and bevel edge
cleaning; and Sahara(TM) for watermark-free drying of both hydrophilic and hydrophobic wafers.
Under a joint development agreement, both companies intend to leverage their expertise to develop solutions for deposition and removal of advanced films used in ALD applications, concentrating on the wafer backside and bevel edge