The validation of the UMC 14nm FinFET
process technology kickstarts the enablement process for the rest of IP ecosystem needed for UMC's FinFET
technology, including the need for foundation IP and ARM processor physical design.
With more than 45 FinFET
test chip tapeouts, Synopsys continues to make significant investments in providing high-quality IP for FinFET
processes, enabling designers to lower integration risk and speed their time to volume production.
The program also was charged with examining non-planar CMOS device structures, including double gate FinFETs
and associated process development to improve their feasibility.
the growing era of extreme mobility, FinFET
technology will be a critical
might enable engineers to sidestep a problem threatening to derail the electronics industry.
In conjunction with TSMC's announcement to support volume production at 16nm, eInfochips is taping-out 16nm FinFET
chips for a leading semiconductor design company.
Sun, said at a technology workshop held by ARM that the company will begin pilot production of 16nm FinFET
chips at the end of 2013 and volume production in 2014.
Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the two companies have partnered to deliver a comprehensive design solution to accelerate the implementation of GLOBALFOUNDRIES' 14 nm-XM FinFET
Qualification of FinFET
and FD-SOI technology platforms enables users to create robust and reliable integrated circuits
Imagination received this recognition in the Graphics IP category for its collaboration with TSMC to develop highly optimized reference design flows and silicon implementations using Imagination s industry-leading PowerVR Series6 GPUs combined with TSMC s advanced process technologies, including 16nm FinFET
Driven by a massively parallel architecture with breakthrough optimization technologies, the Innovus Implementation System provides typically 10 to 20 percent better PPA and up to 10X full-flow speedup and capacity gain at advanced 16/14/10nm FinFET
processes and established process nodes.
The daily reported that TSMC's 2013 capital outlay would mostly go to advanced lithography tools, expansion at its giga fabs in the central Taiwan park and Southern Taiwan Science Park, expansion of its 28nm and 20nm process capacity and development of 16nm FinFET
HSINCHU, Taiwan and CAMBRIDGE, UK, July 23, 2012 /PRNewswire/ -- TSMC (TWSE: 2330, NYSE: TSM) and ARM today announced a multi-year agreement extending their collaboration beyond 20-nanometer (nm) technology to deliver ARM processors on FinFET
transistors, enabling the fabless industry to extend its market leadership in application processors.
At today's Common Platform Technology Forum,GLOBALFOUNDRIES announced results from the industry's first implementation of a dual-core ARM[R] Cortex[TM]-A9 processor using three-dimensional 14nm-XM FinFET
Optimized Implementation of a Performance-focused ARM Cortex-A72 MPCore(TM) Processor in 16nm FinFET
Plus Process Technology Using Synopsys Galaxy(TM) Design Platform, presented by Synopsys, 10:30 am -- 11:20 am, Mission City Ballroom M1.