contact print

(redirected from Contact printing)
Also found in: Dictionary, Encyclopedia, Wikipedia.
Related to Contact printing: Contact printer
  • noun

Words related to contact print

a print made by exposing a photosensitive surface to direct contact with a photographic negative

Related Words

References in periodicals archive ?
The global PCB industry is transitioning from conventional contact printing to digital lithography beyond 50-micron feature sizes.
Screen and contact printing prefer higher viscosity (100,000 cp to 150,000 cp) thixotropes and generate 10 to 25 micron thick features.
With certain new tire designs, the use of traditional contact printing inks can introduce a contaminant to the tread extrusion.
As fine-art photography collectors know, the prized, long-tonal scale palladium-platinum prints only can be produced by contact printing negatives, so print size is usually limited to camera film formats.
Unlike hot-foil coders and Touch Dry contact printing, the quality of print obtained using thermal transfer technology is always high and constant.
Direct-write imaging technology is fast becoming the lithography of choice as the industry moves from contact printing, which is particularly limiting as the PCB industry approaches 50-micron feature sizes.
As the limitations of contact printing become increasingly apparent, particularly as the PCB industry approaches 50 micron feature sizes, customers are quickly turning their attention to Maskless' direct-write imaging technologies, commonly known as DI.
Leveraging our core tech competencies and patented contact printing platform in this manner should further enhance our competitive differentiation in the diagnostics market.
Specific to the Plexcore(R) OC ink, it is a multi-functional conductive material compatible with a number of printing techniques including spin-coating, ink jet printing, and contact printing.
Mergen's manufacturing platform uses contact printing in batch mode assuring high quality spot features and consistency from array to array.
At wafer level, cold embossing is achieved with an adapted contact printing mask aligner while hot embossing is achieved using a substrate bonder, which is commonly used for MEMS manufacturing.